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LEON-G100/G200 - System Integration Manual
GSM.G1-HW-09002-C Preliminary Contents
Page 6 of 75
2.3 Module thermal resistance .................................................................................................................. 60
2.4 Antenna guidelines ............................................................................................................................. 60
2.4.1 Antenna termination ................................................................................................................... 61
2.4.2 Antenna radiation ....................................................................................................................... 62
2.4.3 Antenna detection functionality .................................................................................................. 64
3 Handling and soldering ............................................................................................. 65
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................... 65
3.2 Processing .......................................................................................................................................... 65
3.2.1 Soldering paste............................................................................................................................ 65
3.2.2 Reflow soldering ......................................................................................................................... 65
3.2.3 Optical inspection ........................................................................................................................ 66
3.2.4 Cleaning ...................................................................................................................................... 66
3.2.5 Repeated reflow soldering ........................................................................................................... 67
3.2.6 Wave soldering............................................................................................................................ 67
3.2.7 Hand soldering ............................................................................................................................ 67
3.2.8 Rework ........................................................................................................................................ 67
3.2.9 Conformal coating ...................................................................................................................... 67
3.2.10 Casting ........................................................................................................................................ 67
3.2.11 Grounding metal covers .............................................................................................................. 67
3.2.12 Use of ultrasonic processes .......................................................................................................... 67
4 Product Testing........................................................................................................... 68
4.1 u-blox in-series production test ........................................................................................................... 68
Appendix .......................................................................................................................... 69
A Extra Features ............................................................................................................. 69
A.1 Firmware (upgrade) Over AT (FOAT) ................................................................................................... 69
A.1.1 Overview ..................................................................................................................................... 69
A.1.2 FOAT procedure .......................................................................................................................... 69
A.2 Firewall ............................................................................................................................................... 69
A.3 TCP/IP ................................................................................................................................................. 69
A.3.1 Multiple IP addresses and sockets ................................................................................................ 69
A.4 FTP ..................................................................................................................................................... 69
A.5 HTTP ................................................................................................................................................... 70
A.6 SMTP .................................................................................................................................................. 70
A.7 FOTA (LEON-G200 only) ..................................................................................................................... 70
A.8 GPS .................................................................................................................................................... 70
B Glossary ...................................................................................................................... 71
Related documents........................................................................................................... 73
Revision history ................................................................................................................ 74
- LEON-G100/G200 1
- Page 2 2
- Preface 3
- Page 4 of 75 4
- Contents 5
- Page 6 of 75 6
- Page 7 of 75 7
- 1 System description 8
- 1.2 Architecture 9
- 1.2.1 Functional blocks 10
- Page 11 of 75 11
- 1.3 Pin-out 12
- 1.4 Operating Modes 14
- 1.5.2 Voltage supply (VCC) 17
- 500 mAh … 1100 mAh 22
- Page 23 of 75 23
- Page 25 of 75 25
- 1.6 System functions 26
- Page 27 of 75 27
- 1.6.2 Module power off 28
- 1.6.3 Module reset 29
- 1.7 RF connection 31
- 1.8 Antenna supervisor 31
- 1.9 Audio 31
- Page 32 of 75 32
- Page 34 of 75 34
- Page 38 of 75 38
- Page 40 of 75 40
- 1.10 SIM interface 41
- 1.11 Serial Communication 42
- Page 43 of 75 43
- Page 44 of 75 44
- Page 45 of 75 45
- Page 46 of 75 46
- 1.11.2 DDC (I 47
- C) interface 47
- Page 48 of 75 48
- Page 49 of 75 49
- 1.14 Approvals 50
- 2 Design-In 51
- Pinout_Layout_R1.1(ppt) 52
- Page 54 of 75 54
- Page 55 of 75 55
- Page 56 of 75 56
- Page 57 of 75 57
- Page 58 of 75 58
- 2.4 Antenna guidelines 60
- 2.4.1 Antenna termination 61
- 2.4.2 Antenna radiation 62
- LEON-G100 64
- LEON-G200 64
- 3 Handling and soldering 65
- 3.2.3 Optical inspection 66
- 3.2.4 Cleaning 66
- Page 67 of 75 67
- 4 Product Testing 68
- Appendix 69
- A Extra Features 69
- A.5 HTTP 70
- A.6 SMTP 70
- A.7 FOTA (LEON-G200 only) 70
- A.8 GPS 70
- B Glossary 71
- Page 72 of 75 72
- Related documents 73
- Revision history 74
- Contact 75
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